Alumina Substrates for Thin Film Circuits

  • Professional suppliers of ceramic thin-film substrates

  • Maintains strict process controls and testing parameters to ensure a consistent product on every lot providing optimal value and performance

  • Advanced secondary processes like laser machining, polishing, and lapping

Characteristics

Al2O3 %:≥99.6

Thermal Conductivity:≥30W/m.K@25℃

Size:up to Dia. 8 inch

TCE:7.1 ppm/℃(25-300℃)

Thickness:0.05~2mm,±2%

Surface Finish :

Density:≥3.9 g/cm3

As fired:50-80nm/80-150nm

Water absorption %:0

Lapped:<300nm

Flexural strength:550 MPa

Polished:≤25nm

Dielectric Constant:9.9±0.1@10GHz

Volume Resistivity:≥1*1014 Ω.cm

Dielectric loss tangent:0.0001@10GHz

Dielectric Strength:≥15KV/mm