Silicon carbide CMP carrier disk

The silicon carbide CMP carrier disk of GORGEOUS CERAMICS (GGS Ceramic) is formed by isostatic pressing process and sintered at high temperature. The outer diameter, thickness, number and size of acupuncture points, position and shape of the film extraction slot can also be refined according to the user’s design drawings to meet your specific use requirements.

Quality Packaging and Cleanroom Protection Standards

Silicon carbide CMP carriers are highly precision semiconductor-grade components. They are extremely sensitive to microparticles and static electricity. Therefore, GORGEOUS CERAMICS (GGS Ceramic) uses Class 100 cleanroom packaging and multiple shockproof engineering encapsulations to ensure that the product you receive is free from contamination and damage throughout the entire process.

• Ultra-clean cleaning: Before leaving the factory, the silicon carbide CMP carrier disks undergo multiple ultrasonic pure water cleaning and hot air drying processes. We strictly control the surface particle size and ion residue.
• Double-layer vacuum antistatic packaging: All our packaging is completed in a Class 100 cleanroom and the products are packaged in high-barrier double-layer vacuum antistatic PE bags.
• Dedicated engraving slots: We use high-density EPE foam or anti-static EVA to fully fit the contours of the carrier tray, preventing shaking and bumps during transportation.

Product delivery time

Upon receiving your drawings, we will complete an engineering assessment and quotation within 24 hours. Standard samples can be completed within 3-4 weeks, and complex custom-made parts can be delivered within 4-6 weeks. We also offer a green channel for your urgent orders, providing expedited production services.

Each batch of our carrier trays comes with a Factory Inspection Report (CoC), including flatness, parallelism, coordinate measuring machine (CMM) dimensional measurement data, and material physical property test reports.

Advantages of silicon carbide CMP carrier disks

CMP carrier flatness ≤ 0.003mm

In CMP (Chemical Motion Processing), the planarity accuracy of the carrier pad directly affects the pressure distribution between the wafer and the polishing pad. Even the slightest planar deviation in your carrier pad can lead to uneven local stress on the wafer, causing serious problems such as differences in polishing rate, out-of-bounds defects, and over-polishing of wafer edges, affecting wafer thickness uniformity and yield.

GORGEOUS CERAMICS (GGS Ceramic) silicon carbide CMP carriers utilize a combination of isostatic pressing and high-temperature sintering processes. Through precise machining control, we can achieve flatness ≤ 0.003 mm, parallelism ≤ 0.005 mm, and dimensional tolerances controlled within ±0.01~0.03 mm.

Our products effectively improve polishing uniformity and reduce TTV. Their ultra-flat surfaces can reduce polishing non-uniformity within wafers by 15% to 25%, effectively controlling TTV at the submicron level and significantly improving chip manufacturing and advanced packaging.

Meanwhile, silicon carbide materials have excellent rigidity and dimensional stability, and can maintain low deformation during long-term high-speed rotation and thermal cycling, ensuring the long-term operation of CMP equipment.

High thermal conductivity of 160 W/(m·K)

In CMP (Chemical Metal Polishing), the wafer and polishing pad generate intense frictional heat under extremely high pressure and relatively high speed. If the thermal conductivity and heat dissipation capacity of the carrier pad are insufficient, localized hot spots will form at the wafer contact surface.

GORGEOUS CERAMICS (GGS Ceramic)’s silicon carbide CMP carrier pads possess an ultra-high thermal conductivity of up to 160 W/(m·K), six times that of alumina ceramics, enabling them to rapidly absorb and uniformly conduct and diffuse the heat generated by friction.

Thermal conductivity of silicon carbide and aluminum oxide

Large-size ultra-precision machining capabilities

Semiconductor manufacturing is increasingly evolving towards larger-size (300mm and above) and high-volume multi-cavity polishing equipment. However, due to differences in fixing methods and robotic gripper logic among different brands and models of CMP equipment, standardized components are difficult to directly adapt.

GORGEOUS CERAMICS (GGS Ceramic) is specifically designed to address this pain point, supporting customization up to 500mm in diameter and various non-standard outer diameters and complex irregular contours.

• Supports multi-aperture structures: We can customize high-precision array distributions of single-disk multi-wafer (such as 2/3/4/6 acupoints) with coaxiality ≤ 0.01 mm.
• Plate taking groove and vacuum hole: Supports fine machining of complex flow channels and micro-holes, without burrs or chipping.

Applications of silicon carbide CMP carrier disks

GORGEOUS CERAMICS (GGS Ceramic) silicon carbide CMP carriers can be designed and customized for CMP equipment from various manufacturers. Common manufacturers include:

12-inch (300mm) platform series compatible with Applied Materials:

• Reflexion® LK CMP
• Reflexion® LK Prime CMP
• Opta™ CMP
• Opta™ Quad

Compatible with EBARA-

12-inch (300mm) Platform Series

• F-REX300
• F-REX300X
• F-REX300XA

8-inch (200mm) Platform Series

• F-REX200
• F-REX200M2

Compatible with various mainstream KCTech series

• Ares-300
• Ares-200

Compatible with Huahai Qingke’s 12-inch (300mm) high-end chip manufacturing platform：

• Universal-300 series (including 300 / 300Plus / 300Dual / 300X / 300T)
• Versatile-GP300

Domande frequenti

1. Can the carrier tray structure be customized according to my CMP equipment drawings?

Yes, GORGEOUS CERAMICS (GGS Ceramic) supports customers in precision machining and non-standard customization based on design drawings, including outer diameter, thickness, number and size of acupoints, and position and shape of the tray picking slot.

2. What is the machining precision achievable for multi-cavity carrier discs?

For multi-cavity structures, GORGEOUS CERAMICS (GGS Ceramic) can guarantee the flatness of the overall disc surface within ≤0.003 mm, and the coaxiality and positional accuracy of each cavity will be controlled within ≤0.01 mm.

3. What quality inspection reports do you provide?

We can provide reports according to customer needs, including CMM (coordinate measuring machine) dimensional and geometric tolerance measurement reports, surface flatness/parallelism inspection reports, and material physical property reports.

4. Which CMP carrier pad suppliers are there in China?

GORGEOUS CERAMICS (GGS Ceramic): A supplier specializing in silicon carbide and various specialty ceramics, providing precision machining and customization services for silicon carbide CMP carrier pads.

Huaqing Technology: A Chinese supplier of CMP equipment, offering complete systems in various sizes, as well as supporting polishing heads, carrier pads, and other core components.