Direct Bonded Copper Substrate（DBC）

GORGEOUS CERAMICS is a professional manufacturer of direct-bonded copper (DBC) ceramic substrates.

Our DBC substrates offer excellent heat dissipation, strong electrical insulation, and reliable thermal cycling, providing professional industrial solutions for manufacturers in IGBT modules, power inverters, electric vehicles, renewable energy, and industrial power sectors.

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What is Direct Bond Copper?

Direct Bonded Copper (DBC) is a high-performance composite material formed by directly bonding a highly insulating ceramic substrate (such as alumina Al₂O₃ or aluminum nitride AlN) to a copper (Cu) metal layer.

The production of DBC requires heat treatment at a high temperature of 1065–1085 °C, causing oxidation on the copper surface and a diffusion reaction with the ceramic substrate to form a eutectic bonding layer with a stable structure. This ensures a strong bond between the copper layer and the ceramic substrate, forming a ceramic-metal composite substrate.

Finally, the copper layer is imaged through processes such as exposure, development, and etching to produce the DBC circuit board.

Enterprise Grade Direct Bonded Copper Substrate Solutions

— Large-volume stable supply

 

GORGEOUS CERAMICS is equipped with advanced manufacturing equipment imported from Japan and the United States, including oxidation furnaces, sintering furnaces, ultrasonic systems, ultrasonic cleaning lines, exposure and development lines, etching lines, and anti-oxidation treatment lines. This equipment ensures stable production volume and high-precision manufacturing.

By 2025, our current annual production capacity of copper-clad ceramic substrates exceeds 2 million pieces, and we plan to expand our annual capacity of direct-bonded copper (DBC) to 6 million pieces by 2026.

If you are looking for a reliable DBC ceramic substrate factory, please feel free to contact us. We can provide you with solutions for large-volume, stable production.

 

 

产品展示

Mature, cost-effective, and professional manufacturing processes provide customers with the most specialized technical solutions.

GORGEOUS CERAMICS offers professional solutions for high-quality direct-bonded copper (DBC) using alumina (Al₂O₃) and aluminum nitride (AlN) ceramic materials. Our DBC substrates meet the thermal management requirements of various power and electronic devices.

We offer customized copper and ceramic thickness options to match the coefficient of thermal expansion (CTE) of various semiconductor devices.

Product Features:

  • Excellent thermal conductivity and heat dissipation performance, supporting the high current carrying capacity of your various electronic and power applications.
  • Customizable recessed structures help reduce thermal stress and enhance thermal cycling conditions.
  • A variety of copper surface treatment options are available, capable of withstanding repeated soldering and brazing processes in a temperature range of 180–800 °C.
  • Supports nickel-gold and palladium plating processes, with a variety of cost-effective technology combinations, including surface mount technology (SMT) soldering, low-temperature and high-temperature chip mounting, aluminum wire bonding, gold wire bonding, and strip bonding.
Copper bonded ceramic substrate with high thermal conductivity
Direct Bonded Copper (DBC) ceramic substrate
DBC ceramic substrate for power electronics modules
High precision Direct Bonded Copper ceramic substrate
DBC copper ceramic substrates for power module packaging
Direct Bonded Copper DBC ceramic substrate for IGBT power modules
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Direct Bonded Copper Substrate Parameters

We can also customize solutions according to our clients’ specific needs, providing a one-stop DBC solution.

产品 Substrate thickness Copper foil thickness
Al2O3 Ceramic Substrate 0.25mm 0.2mm
0.38mm 0.2mm,0.25mm,0.3mm
0.5毫米 0.2mm,0.25mm,0.3mm,
0.635毫米 0.2mm,0.25mm,0.3mm,0.4mm
0.76mm 0.2mm,0.25mm,0.3mm,0.4mm,0.5mm
1.0mm 0.2mm,0.25mm,0.3mm,0.4mm,0.5mm
Zirconia-toughened Alumina Ceramic Substrate 0.32mm 0.2mm,0.25mm,0.3mm,0.4mm

Material property parameters

 

Project 氧化铝 锌硫脲 ALN 氮化硅
热导率 (W/MK) 24 24 170 80
Volumeresistivity(Ω.cm) ≥10 14 ≥10 14 ≥10 14 ≥10 14
Dielectricconstant 9.8-10 9-12.5 7.5-9.0 8.3-9.6
Voltage endurance(KV/mm) ≥20 ≥20 >15 >15
Flexuralstrength(MPa) ≥450 ≥700 500-600 600-800
Breaking tenacity(MPam1/2) 3.8-4.2 4.5-5.0 3.0-3.4 6-7
Young modulus(GPa) 340 310 320 310
Thermalexpansivity(ppm/K) 7.1 6.8 4.7 2.6
Cu Conductivity(S/m) 57*106 57*106 57*106 57*106
Peel strength(N/mm) ≥4 ≥4 ≥9 ≥9
Temperature limit -55℃—850℃ -55℃—850℃ -55℃—650℃ -55℃—650℃
Warpage (symmetric structure) ≤3‰ ≤3‰ ≤3‰ ≤3‰
粗糙度 (um) Ra≤0.8 ，Rz≤4 Ra≤0.8 ，Rz≤4 Ra≤0.8 ，Rz≤4 Ra≤0.8 ，Rz≤4

 

 

 

 

Direct Copper-clad Ceramic Substrate Applications

Power Electronics Modules

Applications of direct copper-clad ceramic substrates (DBC) in power electronics: IGBT power modules for industrial motor drives, MOSFET power modules for switching power supplies, power modules for wind power converters, power modules for photovoltaic (solar) inverters, LED driver modules, and high-frequency power conversion modules.

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New Energy Vehicle Power System

Applications of direct copper-clad ceramic substrates (DBC): electric vehicle traction inverters, on-board chargers (OBC), DC-DC converters, power management systems (BMS) modules, motor controllers, power control units (PCU), etc.

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Renewable Energy Equipment

Applications of direct copper-clad ceramic substrates (DBC): solar photovoltaic inverter modules, wind turbine power converter modules, energy storage power conversion systems (PCS), and grid-connected power conversion equipment.

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Industrial Automation Equipment

Applications of direct copper-clad ceramic substrates (DBC): servo motor drivers, variable frequency drives (VFDs), industrial robot power modules, CNC machine tools, and industrial power converters.

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High-Power LED Lighting

Applications of direct copper-clad ceramic substrates (DBC): high-power LED modules, automotive LED headlight modules, industrial lighting, LED heat dissipation substrates.

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Our Certification

GORGEOUS CERAMICS has passed management system certifications such as ISO9001, IATF16949, ISO14001, ISO45001, QC080000, and GB/T29490.

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为什么选择 GORGEOUS？

At GORGEOUS, quality control is our top priority. Every DBC ceramic substrate is manufactured strictly according to customer specifications, undergoing multiple inspections and tests from raw materials to finished products to ensure stable and reliable performance.

In addition to our own testing equipment for raw materials (ceramic substrates), our substrate division is equipped with advanced ceramic copper-clad laminate testing equipment imported from Japan and Germany, including ultra-depth-of-field 3D microscopes, ultrasonic microscopes, thermal shock test chambers, peel strength testers, and lead-free solder baths. This enables us to meet the testing needs of most end customers.

 

常见问题解答

What are some commonly used ceramic materials for direct bonding of copper substrates?

We can provide ceramic materials including alumina (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄) for direct bonding of copper ceramic substrates.

What are the main advantages of DBC ceramic substrates?

Our products offer superior heat dissipation, high current carrying capacity, strong copper-ceramic bonding strength, and excellent reliability during thermal cycling.

What are the applications of DBC ceramic substrates?

Our products can be used in IGBT power modules, electric vehicle inverters, solar and wind power inverters, high-power LED modules, etc.