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Panduan Pembeli Pengadaan Substrat Keramik DBC: Cara Mendeteksi Cacat Sebelum Anda Memesan

Panduan Pembeli Pengadaan Substrat Keramik DBC: Cara Mendeteksi Cacat Sebelum Anda Memesan

Bagian yang gagal terlebih dahulu pada modul daya bukanlah bagian luar yang mencolok, melainkan lapisan keramik di bawahnya. Jika Anda mengumpulkan/membuat pengadaan substrat keramik DBC untuk modul daya, cacat tersembunyi dapat menyebabkan kegagalan di lapangan dengan biaya yang signifikan. Kami akan menjelaskan apa yang harus dipastikan terlebih dahulu. Cacat yang Benar-Benar Menyebabkan Kegagalan Sebagian besar masalah substrat DBC bermuara pada beberapa jenis cacat berulang. Berikut adalah tampilan masing-masing cacat dan alasan kemunculannya: Rongga (Voids) pada Lapisan Pengikat Rongga (voids) adalah gelembung halus yang terperangkap di antara tembaga dan keramik selama proses pengikatan (bonding). Rongga umumnya ditemukan pada pemasok berkualitas rendah. Setelah hanya beberapa...

2026-09-14

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AMB Substrates for Power Modules: What to Check Before You Buy

AMB Substrates for Power Modules: What to Check Before You Buy

Buying AMB substrate? Choose the wrong supplier and you’re in trouble in the field. This guide has 7 checks before you order. Check: in-house bonding, certifications, capacity, quality control, material options, pricing details, and facility readiness. Do this right. Don’t make costly errors later.   What You Should Check Before You Pick a Supplier A datasheet provides you with the numbers. It will not give you an answer as to whether the supplier can maintain the same quality with batch 500 as they did with batch 1. Here are some questions to ask in its place. Does the Supplier Bond […]

2026-07-30

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DBC Substrate Thickness and Copper Layer Guide: What to Specify Before You Order

DBC Substrate Thickness and Copper Layer Guide: What to Specify Before You Order

Struggling to balance thermal dissipation with high-voltage isolation? You can’t make the difficult compromises with off-the-shelf DBCs, because the ceramic is too thick for your thermal budget or the copper is too thin for your current ratings. You need this technical framework  to define custom DBC substrates to exactly meet your power module’s electrical and thermal requirements. What Is a DBC Ceramic Substrate? A DBC substrate is different than a conventional printed circuit board as it is a combination of copper foil that is bonded to a ceramic base without any adhesives or solder between the copper and the ceramic. […]

2026-07-01

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How DBC Ceramic Substrates Are Made: Process, Materials, and Supplier Checklist

How DBC Ceramic Substrates Are Made: Process, Materials, and Supplier Checklist

You are procuring substrates to a power module and you must get it correct. This guide will take you through the DBC ceramic substrate manufacturing process, assist you select the correct ceramic material and what to look at before selecting a direct bonded copper substrate supplier. What Is a Direct Bonded Copper (DBC) Ceramic Substrate? A direct bonded copper (DBC) substrate is a substrate that bonds copper foil to a ceramic base - no adhesives, no solder, nothing in between. You have good thermal conductivity, solid mechanical strength, and electrical insulation all in a single package. This is why DBC […]

2026-04-13

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